德律TR7700SIII3D介紹:
TRI開創性的3D AOI解決方案,采用超高速混合式PCB檢測法,結合光學與藍光雷射3D真實輪廓測量,對于自動化檢測不良現象可達到最大化覆蓋率。結合最先進的軟體解決方案以及第三代智能化硬體平臺,可提供穩定且強大的3D 焊點與元件缺陷檢測,具備高檢測覆蓋率與簡易編程優點。
德律TR7700SIII3D特性:
1.高速2D+3D檢測,可檢測至01005元件
2.高缺陷覆蓋率,采用混合式2D+3D檢測技術
3.真實3D輪廓量測技術,采用雙雷射單位
4.具備自動化資料庫與離線編程功能的智能化快速編程介面
德律TR7700SIII3D規格:
Optical System
Imaging Method | Dynamic Imaging with true 3D profile measurement |
Top Camera | 4 Mpix |
Angle Camera | N/A |
Imaging Resolution | 10 μm, 15 μm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors |
Max. 3D Range | 20 mm |
Inspection Performance
Imaging Speed | 4 Mpix@ 10 μm 2D: 60 cm2/sec 4 Mpix@ 15 μm 2D: 120 cm2/sec 4 Mpix@ 10 μm 2D+3D: 27-39 cm2/sec* 4 Mpix@ 15 μm 2D+3D: 40-60 cm2/sec* * Depending on board size and laser resolution |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 μm |
Board Handling
Max PCB Size | TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1650 x 1650 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
Weight | TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg |