TR7007D Plus 3D SPI平臺配備了優(yōu)化的運(yùn)動控制系統(tǒng)（EtherCat）和高階的2D照明模組，可以準(zhǔn)確地檢測低錫橋缺陷及進(jìn)行板彎補(bǔ)償以消除PCB制程誤差。 TR7007D Plus具有2組數(shù)位條紋光投影，以確保進(jìn)行無陰影檢測。 SPI解決方案簡化了生產(chǎn)線和MES之間的數(shù)據(jù)交換流程，實(shí)現(xiàn)生產(chǎn)線連接數(shù)據(jù)的可追溯性。
德律TR7007DPLUS特性
? 強(qiáng)化2D照明，提供更佳的檢測一致性
? 實(shí)時量測新型運(yùn)動控制系統(tǒng)EtherCat
? SPC數(shù)據(jù)實(shí)時追蹤智能工廠解決方案
? 閉環(huán)(Closed Loop)反饋和前饋功能
德律TR7007D PLUS規(guī)格
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Camera | 4 Mpix |
| Imaging Resolution | 10 μm , 15 μm (factory setting) |
| Lighting | Enhanced 2D Lights (RGB+W) |
| 3D Technology | 2-way Digital Fringe Pattern |
| Field of View | 20x20 mm |
Inspection Performance
| Imaging Speed | Up to 3 FOV/sec |
| Height Resolution | 0.45 μm |
| Max. Solder Height | 420 μm/840 μm |
Motion Table & Control
| X-Axis Control | Ballscrew + EtherCAT motion controller |
| Y-Axis Control | Ballscrew + EtherCAT motion controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 0.5 μm |
| Z-Axis Resolution | N/A |
Board Handling
| Max PCB Size | TR7007D Plus: 510 x 460 mm TR7007D Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
| PCB Thickness | 0.6 - 5mm |
| Max PCB Weight | 3kg. Optional: 5kg |
| Top Clearance | 50 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
Dimensions
| WxDxH | TR7007D Plus: 1000 x 1400 x 1650 mm TR7007D Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
| Weight | TR7007D Plus: 750 kg TR7007D Plus DL: 830 kg |
