德律TR7007D介紹:
TR7007D SPI建基于最新的3D投影技術,以最具成本效益的解決方案提供優異的檢驗性能。TR7007D在線型檢測系統,可自動優化檢查路線以提供絕佳的性能表現。且TRI創新的智能板彎補償系統可彌補檢查過程中的板彎。搭配雙光源數字條紋投影檢測,TR7007D是最可靠的SPI解決方案,可以極具競爭力的價格提供精確的檢測效能。
德律TR7007D特性:
1.100%無陰影的雙光源/四光源數位條紋投影檢測
2.優化的走停式設計最大精度
3.智能板彎補償可免除PCB變形的問題
4.100%的錫膏缺陷覆蓋率,低錫橋亦可檢出
德律TR7007D規格:
Optical System
Imaging Method | Stop-and-Go Imaging |
Camera | 4 Mpix or 12 Mpix (factory setting) |
Imaging Resolution | 6 μm, 10 μm , 15 μm (factory setting) |
Lighting | RGB True Color LED |
3D Technology | 2-way Digital Fringe Pattern |
Field of View | 4 Mpix@ 10 μm: 20.3 x 20.3 mm 4 Mpix@ 15 μm: 30.5 x 30.5 mm 12 Mpix@ 6 μm: 24.4 x 18.4 mm* 12 Mpix@ 10 μm: 40.8 x 30.7 mm 12 Mpix@ 15 μm: 61.2 x 46.1 mm * 6 μm is not available for TR7007D DL |
Inspection Performance
Imaging Speed | 4 Mpix: 3 FOV/sec 12 Mpix: 2 FOV/sec 12 Mpix CoaXPress: 3 FOV/sec* Note: Inspection speed depends on PCB and inspection conditions * With optional CoaXPress upgrade |
Height Resolution | @ 6 μm: 0.22 μm @ 10/15 μm: 0.4 μm |
Max. Solder Height | @ 6 μm: 210/420 μm @ 10/15 μm: 420/840 μm |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 1 μm (up to 0.5 μm with optional linear encoder) |
Z-Axis Resolution | 1 μm (up to 0.5 μm with optional linear encoder) |
Board Handling
Max PCB Size | TR70007D: 510 x 460 mm* TR7007Q DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane * 6 μm is only available for TR7007D, the Max. PCB size is 330 x 310 mm |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement | Height Area Volume Offset |